This product uses a MEMS pressure sensor chip with a silicon silicon bonding structure. The pressure sensor chip is packaged on a surface mounted ASIC chip and a protective circuit FR4, AL substrate or ceramic substrate through a special process, and covered with protective adhesive inside the protective frame. After linear verification and temperature compensation, the analog signal output of the product is proportional to the supply voltage and has a linear function relationship with the input pressure. The supply voltage is 5 ± 0.25V, and the typical current is 3mA. This product can be customized according to the customer's unique input-output characteristic curve.