DIP packaged pressure sensor

This product uses a MEMS piezoresistive pressure sensor chip with a silicon silicon bonding structure, which is packaged in a DiP6 plastic casing through a special process. Under standard working constant voltage and current power supply, the sensor can output millivolt level voltage signals that have a good linear relationship with the measured pressure.

Product Description

Specification parameters

overview

♦ MEMS technology
♦ High reliability, low drift
♦ Gauge pressure form
♦ Suitable for rapid assembly
♦ Working temperature: -40 ∽ 125 ℃
♦ Storage temperature: -55 ∽ 150 ℃
♦ Fluorosilicone gel protection effectively avoids the influence of media such as moisture, oil, weak acids and bases.

application area

♦ Altimeter/Barometer
♦ TMAP
♦ TPMS/Handheld Tire Pressure Gauge and Handheld Pressure Gauge
♦ Oil pressure detection
♦ Absolute pressure control system
♦ Engine control
♦ Atmospheric pressure measurement
♦ Air pressure gauge, GPS navigation assistance, weather forecast, medical monitoring

Project	excitation voltage	pressure range	output range	zero output	full temperature coefficient	zero temperature coefficient	resistance temperature coefficient	nonlinear	bridge impedance	overload pressure	failure pressure
MT010R/X	5	-10~10	50~75	-15~15	-0.2	-0.6-0.6	2400	-0.3~0.3	4-6	2X	>3x
MG040R/X	5	-40~40	60-90	-15~15	-0.2	-0.6-0.6	2400	-0.3~0.3	4-6	2X	>3x
MG100R/X	5	-100~100	70-100	-15~15	-0.2	-0.6~0.6	2400	-0.3~0.3	4-6	2X	>3x
MG200R/X	5	-200-200	70~110	-15~15	-0.2	-0.6-0.6	2400	-0.3~0.3	4-6	2X	>3x